The Biggest Questions About AI
The map · 1 Trajectory · 1.1 Scaling, resources, and technical limits · 1.1.4

Physical bottlenecks

Will chips, fabrication, memory, networking, electricity, cooling, land, or capital materially slow progress?

Training compute has grown ~4–5× per year. Power availability, HBM supply, advanced packaging, and the sheer capital intensity of frontier clusters are the leading candidates for what binds first.

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What changed
October 2025–August 2026 · swept August 3, 2026 · editorial review pending
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The bottleneck moved up the stack: packaging and high-bandwidth memory — not logic dies, and not yet electricity — are where 2025 supply actually bound, and the IEA now finds grid delays trimming the aggressive buildout scenarios. Patel adds a demand-side twist: if models can do more valuable work per chip, compute prices can rise 10x even as supply grows.

Recent thinking
4 featured from 7 tracked · October 2025–August 2026 · all 7 chronologically →
Dwarkesh Patel · dwarkesh.com · 29 Jul 2026 essay
Why compute might get 10x+ more expensive in coming years
If a human-level software engineer that could run on an H100 equivalent, at current market rates for software engineers, that H100 should rent for over $250k a year. That's 15x today's spot price.

Supply can only grow ~3x/year while model capability lets the same hardware monetize far more work, so compute prices must rise sharply — a fresh mechanism by which physical inputs bind capability progress.

Venkat Somala · Epoch AI Data Insights · 12 Mar 2026 report
Advanced packaging and HBM, not logic dies, were the bottlenecks on AI chip production in 2025
the four largest AI chip designers collectively consumed around 90% of global CoWoS capacity and HBM supply in 2025, while consuming only 12% of advanced logic die production

Pins down empirically which stage of the chip supply chain binds first: packaging and memory are near-saturated and slow to expand, while logic-die capacity leaves ample headroom.

International Energy Agency · IEA · Apr 2026 report
Key Questions on Energy and AI
Bottlenecks across the value chain, however, are reducing the likelihood of more aggressive near-term scenarios, despite booming investment and surging project pipelines.

The IEA's follow-up to its 2025 Energy and AI report: grid-connection delays and equipment bottlenecks are already trimming aggressive data-center scenarios, pushing developers toward onsite gas generation.

Jaime Sevilla & Anton Troynikov · Epoch AI · 28 Oct 2025 essay
Could decentralized training solve AI's power problem?
it would be technically feasible to distribute training for multi-gigawatt-scale clusters across dozens of sites, thousands of kilometers apart

Single-site power availability need not cap training-run scale: multi-site distributed training is technically feasible with minimal overhead — weakening the strongest version of the electricity-binds-capability argument.

Additional relevant discussion (3)
Reiner Pope – Chip design from the bottom up — Reiner Pope, with Dwarkesh Patel · Dwarkesh Podcast · 22 May 2026
Memory has grown to nearly two-thirds of AI chip component costs — Venkat Somala · Epoch AI Data Insights · 21 May 2026
The record for power capacity in a single data center has doubled every 10 months — Axel Campos and Ben Cottier · Epoch AI · 4 Sep 2026
Foundational reading (2)Can AI Scaling Continue Through 2030?Epoch AI · 2024Announcing GPT-4.5: “out of GPUs” — compute as the binding constraint, liveSam Altman (@sama) on X · 2025
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